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AFCT-5179BZ

Manufacturer Part Number:
AFCT-5179BZ
Manufacturer / Brand
Foxconn OE Technologies Singapore Pte. LTD
Part of Description:
TXRX 125MBD DUPLEX BLACK SC 1X9
Datasheets:
AFCT-5179BZ.pdf
Lead Free Status / RoHS Status:
ROHS3 Compliant
Stock Condition:
New original, Stock Available.
Ship From:
Hong Kong
Shipment Way:
DHL/Fedex/TNT/UPS

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Part Number AFCT-5179BZ
Manufacturer / Brand Foxconn OE Technologies Singapore Pte. LTD
Category Optoelectronics > Fiber Optics - Transceiver Modules
Description TXRX 125MBD DUPLEX BLACK SC 1X9
Lead Free Status / RoHS Status: ROHS3 Compliant
Wavelength 1300nm
Voltage - Supply 3.1V ~ 5.25V
Series -
Package Bulk
Mounting Type Through Hole
Data Rate 125MBd
Connector Type SC
Base Product Number AFCT-5179
Applications Ethernet

Packaging

We offer the highest quality, most economicallypriced static shield packaging available. With 40% light transparency, itallows for easy identification of IC's (integrated circuits) and PCB's (printedcircuit boards). The extremely durable buried metal contruction gives FaradayCage performance needed to effectively shield these componenets against staticcharge.

All the products will packing in anti-staticbag. Ship with ESD antistatic protection.
Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.
We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.
After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.
We can offer worldwide express delivery service, such as DHLor FedEx or TNT or UPS or other forwarder for shipment.

Global Shipment by DHL/FedEx/TNT/UPS

Shipping Fees reference DHL/FedEx
1). You can offer your express delivery account for shipment, ifyou haven’t any express account for shipment, we can offer our account inadvance.
2). Use our account for shipment, Shipment charges(Reference DHL/FedEx, Different Countries has different price.)
Shipment charges: (Reference DHL and FedEX)
Weight(KG): 0.00kg-1.00kg Price(USD$) : USD$60.00
Weight(KG): 1.00kg-2.00kg Price(USD$) : USD$80.00
* The price of cost is reference with DHL/FedEx. The detail charges, please contact us. Different country the express charges are different.



AFCT-5179BZ Product Details:

AFCT-5179BZ: A High-Performance 1x9 Transceiver for ATM and SONET Applications The AFCT-5179BZ is a high-performance 1x9 transceiver module designed for applications in ATM and SONET systems. Its main features include reliable high-speed performance, excellent accuracy, and outstanding efficiency. In this article, we’ll provide an in-depth analysis of the AFCT-5179BZ, including its specific features, usage, and application scenarios. We’ll also discuss the different types of integrated circuits, the complex manufacturing process, and the importance of appropriate packaging and testing to ensure component quality. AFCT-5179BZ Main Features and Performance Parameters The AFCT-5179BZ is a fiber-optic transceiver module that supports ATM and SONET application systems. It has a maximum data rate of up to 155Mbps, with a wavelength range of 1310nm and a transmission distance of up to 15km. Moreover, it operates with a supply voltage of 3.3VDC and an operating temperature range of -40°C to 85°C. With its excellent accuracy and efficiency, the AFCT-5179BZ can ensure reliable data transmissions for a wide range of applications. Its output voltage is 2.7~3.3V, and the maximum output current is 25mA. Additionally, the transceiver module has an outstanding receive sensitivity of -36dBm and a minimum extinction ratio of 8dB. Application Scenarios and Usage of AFCT-5179BZ The AFCT-5179BZ is primarily used in ATM and SONET systems and is widely applicable in electronic devices, industries, and specific applications. For example, it can be used for network data transfer in telecoms systems, Ethernet, SDH, and FDDI applications. Furthermore, this 1x9 optical transceiver is suitable for applications that require high-quality optics in harsh environments, like industrial facilities, power transmission systems, and transportation systems. Understanding Different Types of Integrated Circuits Integrated circuits (ICs) are the backbone of electronic devices, and understanding their types and features is essential to choose the best components for a given application scenario. Digital, analog, mixed-signal, and RF integrated circuits are the most common types. Digital ICs process information in a digital (binary) format, making them suitable for digital systems like computers and mobile devices. Analog ICs can process continuous information, making them suitable for applications like audio and video equipment. Mixed-signal ICs are a combination of digital and analog circuits, enabling both digital and analog processing in a single device. RF ICs are used to process radio frequency signals, allowing devices like mobile phones to communicate wirelessly. Complex Manufacturing Process The AFCT-5179BZ module is designed using the latest technology and undergoes an intensive manufacturing process that includes chip design, cutting, cleaning, laser processing, back grinding, doping, exposure, vapor deposition, and etching. This complex process ensures the reliable performance of the component. Packaging and Testing of Finished Products The quality of the finished product is critical, and appropriate packaging and testing are essential to ensure component quality. The AFCT-5179BZ module undergoes appropriate packaging and testing, including visual inspection, functional testing, and environmental testing, before it is delivered to end-users. Conclusion In conclusion, the AFCT-5179BZ is an excellent high-performance 1x9 transceiver module designed for ATM and SONET applications. With its outstanding performance, accuracy, and efficiency, it is widely applicable in electronic devices, industries, and specific applications. Understanding the different types of integrated circuits, the complex manufacturing process, and the importance of appropriate packaging and testing is essential in choosing the right component for your application scenario.

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